Dongguan Tianyu Semiconductor Technology Co., Ltd.
Project: FMCS System Engineering for Guangdong Tianyu Semiconductor Co., Ltd. Headquarters and Manufacturing Center Construction Project (Phase I & II)
Location: Dongguan, Guangdong
Duration: 2023–2024
Project Scale: RMB 50 million
Delivery Period: 362 days
Scope of Services: FMCS automation system, gas system engineering (bulk gas and specialty gas)
Main Features: The Guangdong Tianyu Semiconductor Co., Ltd. Headquarters and Manufacturing Center Project has a total investment of RMB 8 billion, covering an area of approximately 165 acres with a total construction area of about 240,000 square meters. The facility is designed for the production of 6-inch and 8-inch silicon carbide (SiC) epitaxial wafers, with an expected annual capacity of 1.5 million wafers.
